We’ve been anxiously awaiting the arrival of the Sony Xperia Z3 and its smaller sibling, the Z3 Compact. Call us sick in the heads, but we take a certain amount of pleasure in watching the disassembly of these tiny pocket computers with the Sony Xperia Z3 being no different.
The phone is the subject of a new teardown by the folks at Ewisetech, giving us an up close look at everything that makes the Z3 tick. For interested parties, take a look at a few of the upcoming smartphone’s exposed parts down below.
Unsurprising, there’s not too much different from the older Z2 model (this ones got more rounded edges). The back plate is removed rather easily, using some kinda of foam insulation to keep a water tight seal. Once cracked open, inside you’ll find the use of Samsung RAM/ROM, and a handful of chips from Broadcom and Qualcomm on the exposed motherboard.
If nothing else, we were surprised at how clean and modular all the internal parts were, leaving us confident that replacing parts on the device shouldn’t be too troublesome. Fore more pictures, check out the source link below.
[Ewisetech | via Xperia Blog]
from Phandroid http://ift.tt/1uzMTGV
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